Dicing aluminum nitride AlN wafers and substrates

Dicing Aluminum Nitride AlN Wafers and Substrates

Dicing of Aluminum Nitride wafers and substrates, both in dicing prototype and dicing production quantities at East Coast and West Coast facilities.

  • Dicing patterned wafers and substrates
  • Dicing circuited wafers
  • Dicing step and repeat patterns
  • AlN hybrids
  • V-grooves
  • Slots and steps
  • Cubes
  • Heat sinks
  • Pyramids
  • Towers
  • Hexagons
  • Triangles
  • Octagons

CRITICAL PARAMETERS such as: cutting speed, spindle speed, surface speed, depth of cut, blade cooling and type of blade are constantly monitored and can vary with PRODUCT AND MATERIAL TYPE. It is important to know if the material is: thin tape cast AlN, thick tape cast AlN, dry pressed AlN or some other type.

Aluminum Nitride varies greatly between manufactures and could require dicing parameter changes.
For a complete summary of dicing capabilities click here

Other links to Aluminum Nitride related sites.

















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