Dicing Aluminum Nitride AlN Wafers and Substrates


Dicing of Aluminum Nitride wafers and substrates, both in dicing prototype and dicing production quantities at East Coast and West Coast facilities.

CRITICAL PARAMETERS such as: cutting speed, spindle speed, surface speed, depth of cut, blade cooling and type of blade are constantly monitored and can vary with PRODUCT AND MATERIAL TYPE. It is important to know if the material is: thin tape cast AlN, thick tape cast AlN, dry pressed AlN or some other type.

Aluminum Nitride varies greatly between manufactures and could require dicing parameter changes.
For a complete summary of dicing capabilities click here


Other links to Aluminum Nitride related sites.

AlN informative Web sites:

  • www.aluminumnitride.com/alnplus.htm Chemical analysis of Aluminum Nitride substrates
  • www.aluminumnitride.com/beo-aln.htm Beryllium oxide substrates vs. Aluminum Nitride substrates
  • www.aluminumnitride.com/polished.htm Polished Aluminum Nitride AlN substrates and wafers
  • www.aluminumnitride.com/substrate-mfg.htm Tape cast Aluminum Nitride substrate manufaturing
  • Return to Home Page: Aluminum nitride substrates, aluminum nitride wafers

    AlN Composition AlN Related Links AlN Replacs BeO AlN Stock Aluminum Nitride Aluminum Nitride Stock Direct Bond Copper Hi Therm Properties Hi Therm Substrate Stock Polished AlN Substrates Sapphire Tape Cast Substrates Ultra-thin AlN


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    Return to top of page Last updated: 27 August 2007
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