Direct Bond Copper on Aluminum Nitride Substrates

DBC is a process where solid Copper foil is bonded to AlN substrate at a high temperature in an inert atmosphere. These DBC substrates can have Copper thickness from 0.001" (25 microns) to 0.012" (300 microns) and can be nickel or gold plated if required.

Why Aluminum Nitride substrates with DBC?

Thermal management related Web sites:

  • www.aluminumnitride.com/beo-aln BeO and AlN substrates
  • Return to Home Page: Aluminum nitride substrates, aluminum nitride wafers

    AlN Composition AlN Related Links AlN Replacs BeO AlN Stock Aluminum Nitride Aluminum Nitride Stock Dicing Hi Therm Properties Hi Therm Substrate Stock Polished AlN Substrates Sapphire Tape Cast Substrates Ultra-thin AlN


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