Direct Bond Copper on Aluminum Nitride Substrates
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Advanced Search Powered by KSearch 1.5b Direct Bond Copper on Aluminum Nitride SubstratesDBC is a process where solid Copper foil is bonded to AlN substrate at a high temperature in an inert atmosphere. These DBC substrates can have Copper thickness from 0.001" (25 microns) to 0.012" (300 microns) and can be nickel or gold plated if required.Why Aluminum Nitride substrates with DBC?
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Return to Home Page: Aluminum nitride substrates, aluminum nitride wafers Updated: 19 October 2010 |
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